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  1. Okamoto Corporation Semiconductor Equipment Division Home Page

    OKAMOTO CORPORATION, Semiconductor Equipment Division is providing Sales & Service for Wafer Back Grinder for Si-Ge-Altic-GaAs-SOI-Silica, Polisher, Pitch ...
    Chemical3
    Mechanical2
    polish2
    grinding2
    polishing2
    saw2
    grinder2
    CMP1
    backend1
    lapping1
    slicer1
    polisher1
    slicing1
    dicing1
    Okamoto1
    dicer1
    lappers1
    Planarization1
    Shibayama1
    dicing saw1
    wafer thinning1
    downfeed grinder1
    backgrinder0
    dicing machine0
    infeed grinder0
    Pitch Polisher0
    SOI Grinder0

    www.okamoto-sed.com - 2009-02-04

  2. SPEEDFAM-PW INDEX

    Peter Wolters is a machine tool manufacturer with headquarters in Rendsburg/Germany. The product portfolio covers tools for polishing, CMP, lapping, honing, ...
    free8
    photo6
    metal4
    single4
    machine3
    fine3
    tool3
    ceramic3
    chemical3
    mechanical2
    double2
    glas2
    polish2
    side2
    grinding2
    disk2
    quartz2
    mask2
    polishing2
    semiconductor2
    prime2
    inch2
    wafer1
    rigid1
    CMP1
    honing1
    lapping1
    haze1
    300mm1
    200mm1
    planarization1

    www.speedfam-pw.com - 2009-02-12

poland2 polska2 english4 electrical3 french3 italian3 chemicals2 dématérialisation1 design7 mechanical2 cmp1 spanish3 chemical3 german3 engineering4 appel d'offres1 mat2 germany3 industrial4

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