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  1. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
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    www.nexxsystems.com - 2009-02-06

  2. BGA Rework / Die Bonder / Flip Chip Equipment - FlipChip Bonder and BGA Rework

    Manufacturer of Flip Chip Bonder, Die Bonder and BGA Rework Equipment.
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    www.bgarework.com - 2009-02-05

  3. MicroFab Technologies, Inc.

    Alternative Energy Apllications News : MicroFab announces SphereJet Precision Microsphere Manufacturing System and VaporJet Trace Vapor Detector Calibration ...
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    drug coated0
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    www.microfab.com - 2009-02-08

  4. SiliConSult.com - Microelectronics & High Density Packaging Solutions

    4085 visitors since November 1st, 2002 Your Nordic resource for the technologies of Silicon, ASIC Design and Microsystems Integration! [Experience & Expertise] ...
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    www.siliconsult.com - 2009-02-12

  5. Teraspeed - Interconnect Engineering, Advanced Printed Circuit Design, Signal Integrity, Electromagnetic Modeling, Package Design and Characterization, Powe ...

    about engineering links news publications training © 2007 Teraspeed® Consulting Group LLC For warranty, copyright & license information see the Disclaimers and N ...
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    www.teraspeed.com - 2009-02-06

  6. CHIP-FLIP - Europe's Leading Electronic Component Sourcing Database

    CHIP-FLIP - Europe's leading electronic component sourcing database
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    www.chip-flip.com - 2009-04-03

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