EPSI INC. - Electronics Packaging Solutions International Inc. P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815 e-mail: ...

A leader the in development and applications of advance material and adhesive solutions for electronic interconnection and packaging

~~~ Da Nonna - Technical Consultant - Microelectronics ~~~

MillPack is a provider of engineering services targeting CAD layout of multi-chip modules, semiconductor packaging and high-density printed circuit boards.

AuleeTech conducts Trainings and Maintenance for the Semiconductor Flip-Chip Industry. We sell second hand spare parts/equipment. Micron2 (ESEC), Micron5003 ...

ProtoRun specializes in building of electronic assemblies in small quantities.

NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...

Manufacturer of Flip Chip Bonder, Die Bonder and BGA Rework Equipment.

Alternative Energy Apllications News : MicroFab announces SphereJet Precision Microsphere Manufacturing System and VaporJet Trace Vapor Detector Calibration ...

X-Tek Microfocus X-Ray inspection systems for Electronics, Automotive, Aerospace, Medical, NDT Applications. Our systems come with our latest iXS software ...