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  1. BGA Rework / Die Bonder / Flip Chip Equipment - 芯片键合及SMT返修设备

    Manufacturer of BGA rework equipment and flip chip die bonder
    RFID2
    BGA1
    QFN1
    VCSEL1

    www.fineplacer.com.cn - 2009-03-10

components3 qfp1 bga1 csp1 plcc1 botox2 dip1 fiber2 lasik2 abr2 electronic components2 pcb2 optic2 for sale4 diodes1 laser3 fibre2 capacitors2 lasek1 assembly2 data3

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