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tresky
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  1. Semiconductor Equipment and Services

    Semiconductor Equipment Wire Bonder Die-Bonder Flip-Chip Screen-Printers
    Soffa1
    Aurel1
    Kulicke1
    Tresky1

    www.xipeq.com - 2009-02-09

  2. die bonder, component placer, ejector, tresky, Dr Tresky AG

    Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
    Semiconductor2
    flip chip1
    die bonder1
    component placer1
    Tresky1
    Dr Tresky0
    Dr Tresky AG0
    Microsystemtechnic0

    www.tresky.com - 2009-02-05

csp1 flip chip1 microsystemtechnic0 semiconductor2 bga1 equipment4 electronic3 electronics4 pcb2

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