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  1. PHIFER SMITH CORPORATION

    Process technology IP and key process hardware components for enabling high performance single-substrate wet-cleaning and surface-treatment
    treatment4
    cleaning3
    manufacturing3
    wet3
    processing2
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    surface2
    substrate1
    dielectric1
    low-k1
    residue removal1
    photoresist removal1
    post-etch1
    SiCOH1
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    copper-passivation1
    post-CMP1

    www.cuprozone.com - 2009-02-11

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