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  1. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
    chip scale package1
    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

  2. AEMtec GmbH

    AEMtec ist der führende Anbieter für die Produktion von optischen und elektronischen Multi-Chip-Modulen in Mischtechnologie.
    Bonding2
    SMT2
    CSP1
    COB1
    BGA1
    Surface Mount Technology1
    Bonden1
    Ball Grid Array1
    Flip Chip1
    Chip on Board1
    Die Bonding1
    Multi-Chip1
    Mischtechnologie1
    Multi Chip1
    Opto Packaging1
    AEMtec0
    Chip-Size Packaging0

    www.aemtec.de - 2009-02-05

  3. KGD Packaging & Test Workshop

    The annual KGD Packaging and Test Workshop in Napa, California focuses on semiconductor die products test, assembly, manufacturing, and business issues at the ...
    conference3
    workshop3
    seminar3
    package3
    tutorial3
    module2
    sip2
    semiconductor2
    reliability2
    wafer1
    dpc1
    stacked1
    burn-in1
    flip chip1
    chip on board1
    kgd1
    multi-chip1
    known good die1
    system in package1
    die products1

    www.napakgd.com - 2009-02-04

  4. Space Applications - Honeywell Aerospace

    Honeywell is proud of our nearly 40-year heritage in designing and building successful flight hardware and software, and providing innovative solutions to our ...
    other4
    data3
    control3
    satellite3
    navigation2
    controls2
    guidance2
    semiconductor2
    avionics2
    telemetry2
    data processing2
    ASICS1
    microelectronics1
    pointing1
    vibration isolation1
    semi-conductors1
    prime contractors1
    military services1
    space systems1
    launch vehicle1
    multi-chip1
    range safety1
    space agencies1
    guidance and navigation1
    Space applications1
    pointing control1
    accurate momentum control0
    missile interceptor0
    momentum control0
    redundant tracking0

    www.myspacesystem.com - 2009-02-05

bga1 chip scale package1 csp1 pcb2 for sale4 abr2 ball grid array1 assembly2

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