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  1. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06

fairline1 charter3 flip-chip1 jeanneau1 beneteau1 bridges2 bga1 bonding2 csp1 bavaria2 flip chip1 dehler1 crowns2 assembly2 pcb2 princess2 dentist3

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