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A free, neutral source providing micropackaging tutorials,articles, abstracts, technology updates, photographs, newsletter, supplier directory
bumped wafers  chipscale package  flip chip abstracts  flip chip articles  flipchip articles  flip chip information  flipchip information  flip chip literature 
www.flipchips.com - 2009-02-04
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NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
flip chip advanced packaging  redistribution layers  under bump metallization 
www.nexxsystems.com - 2009-02-06
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Utrecht Micro-Engineering Competence Centre
current hall  electro optisch  infrarood scanner  microdialysus  microlenzen  microstructuren  microsysteem  microverbinding  microverbindingen 
www.umecc.nl - 2009-04-09
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1Talon semiconductor has a robust DI process for real world analog bipolar design requirements Rad Hard. Combines with their unique patented packaging ...
dielectrically isolated  DI process  Solder flip chip 
www.1talon.com - 2009-02-07
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DoctorFlipchip home page
www.doctorflipchip.com - 2009-02-06
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