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NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
flip chip advanced packaging  redistribution layers  under bump metallization 
www.nexxsystems.com - 2009-02-06
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International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
Advanced Chip Packaging  Au Bumping  Bare Die Packaging  Copper Pillar Bumps  Fine Pitch Bumps  Flip Chip Packaging  Gold Bump  Gold Bumping  Indium Bumping  Indium Bumps  Known Good Packaging  Pillar Bumps  Sn Bumping  Sn Bumps  Solder Bumps  Tape Automated Bonding  Tin Bumps  Tin Lead Bumps  Wafer Electroplating  Wafer Level Processing 
www.imi-corp.com - 2009-02-06
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diamonds
aluminum
csp
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