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  1. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06
  2. International Micro Industries, Inc.

    International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
    Advanced Chip Packaging0
    Au Bumping0
    Bare Die Packaging0
    Copper Pillar Bumps0
    Fine Pitch Bumps0
    Flip Chip Packaging0
    Gold Bump0
    Gold Bumping0
    Indium Bumping0
    Indium Bumps0
    Known Good Packaging0
    Pillar Bumps0
    Sn Bumping0
    Sn Bumps0
    Solder Bumps0
    Tape Automated Bonding0
    Tin Bumps0
    Tin Lead Bumps0
    Wafer Electroplating0
    Wafer Level Processing0

    www.imi-corp.com - 2009-02-06

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