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  1. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06

pvd1 coating2 bridges2 metal4 flip-chip1 coat2 diamond3 flip chip1 crowns2 csp1 automotive4 bonding2 dlc1 assembly2 bga1 pcb2 etch1 dentist3

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