With over 500 single Bond Chambers and a total of more than 100 fully automated wafer bonding systems in the field of MEMS (Micro-Electro-Mechanical-Systems), ...

EV Group (EVG) - Thin Wafer Processing 3D Interconnect, TSV, Power Devices, Compound Semiconductor, Packaging, MEMS, Temporary Bonding and Debonding Technology, ...

EV Group is a recognized technology and market leader for wafer processing equipment. We have set worldwide industry standards for aligned wafer bonding as well ...

EV Group (EVG)  3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed ...