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MillPack is a provider of engineering services targeting CAD layout of multi-chip modules, semiconductor packaging and high-density printed circuit boards.
bga design  chip-scale package  flex-circuit 
www.millpack.com - 2009-02-12
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Dimation serves the avionics, medical, defense, and consumer market sectors with quick-turn electronic prototype and advanced die-level services.
die level service  electronic card assembly  monolithic packaging  wafer picking  water sawing 
www.dimation.com - 2009-02-06
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csp
bga
chip-on-board
flip-chip
mcm
assembly
cob
flipchip
pcb
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